Semiconductor Packaging Market Materials Share, Growth, Trends and Forecast to 2021: Market size forecasters

Semiconductor packages are plastic, ceramic, and metal components that are not only protect fabricated integrated circuits (ICs) on the semiconductor die, but also act as an interconnect between the printed circuit board (PCB) and the die during shipping and handling. These packaging materials safeguard and protect the die from the external mechanical impacts and corrosion, besides acting as an electrically conductive interconnection with excellent signal propagation properties.

Excessive heat in the integrated circuit is dissipation through attached heat spreaders. Semiconductor packaging components vary in dimensions and functionality and are mainly organic substrates, bonding wires, encapsulation resins, lead frames, thermal interface materials, die attach materials, and solder balls.

The key customers of these packaging materials are the electronics industry, automotive sector, fabless semiconductor companies, packaging material suppliers, and packaging subcontractors.

Get Discount on this Report: https://marketsizeforecasters.com/enquire-for-discount/406733/?utm_source=ABD-dc

Market Size forecasters analysts forecast the global semiconductor packaging materials market to grow at a CAGR of 5.27% during the period 2017-2021.

Market driver

Increasing miniaturization of electronic devices and growing application of semiconductor ICs in IoT

Scope of the Report:

This report focuses on the scenario and the growth prospects of the global semiconductor packaging materials market for 2017-2021. To calculate the market size, the report considers the revenue generated by vendors through the sales of semiconductor packaging materials which are organic substrates, lead frames, bonding wires, encapsulation resins, die attach materials, solder balls, thermal interface materials, and WLP dielectrics.

Market Segment by TOP Manufacturers, this report covers:

Amkor Technology, DuPont, Henkel, Honeywell, Kyocera,Toppan Printing, Hitachi Chemical, ASM Pacific Technology, BASF, Beijing Kehua New Chemical Technology

Market Segment by Regions, regional analysis covers:

North America (USA, Canada and Mexico), Europe (Germany, France, UK, Russia and Italy), Asia-Pacific (China, Japan, Korea, India and Southeast Asia), South America (Brazil, Argentina, Columbia etc.), Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa).

Key questions answered in this report

  • What will the market size be in 2021 and what will the growth rate be?
  • What are the key market trends?
  • What is driving this market?
  • What are the challenges to market growth?
  • Who are the key vendors in this market space?

Market Size forecasters presents a detailed picture of the market by way of study, synthesis, and summation of data from multiple sources.

The analysts have presented the various facets of the market with a particular focus on identifying the key industry influencers. The data thus presented is comprehensive, reliable, and the result of extensive research, both primary and secondary.

The success of our approach lies in the fact that we take the viewpoint of all stakeholders into consideration while analyzing an industry, and objectively assess each outlook.

Get Sample Copy of this Report: https://marketsizeforecasters.com/get-sample/406733/?utm_source=ABD-dc

Market Size forecasters have List of Exhibits upto 83

Exhibit 01: Steps in back-end chip formation

Exhibit 02: Roadmap of semiconductor packaging

Exhibit 03: Old supply chain of semiconductor IC packaging industry

Exhibit 04: New supply chain of semiconductor IC packaging industry

Exhibit 05: Related market

Exhibit 06: Semiconductor packaging materials technologies

Exhibit 07: Global semiconductor packaging materials market overview

Exhibit 08: Market characteristics

Exhibit 09: Market segments

Exhibit 10: Market definition – Inclusions and exclusions checklist

Exhibit 11: Market size 2016

Exhibit 12: Validation techniques employed for market sizing 2016

Exhibit 13: Global semiconductor packaging materials ? Market size and forecast 2016-2021 ($ billions)

Exhibit 14: Global semiconductor packaging materials market? Year-over-year growth 2017-2021 (%)

Exhibit 15: Five forces analysis 2016

Exhibit 16: Five forces analysis 2021

Exhibit 17: Bargaining power of buyers

Exhibit 18: Bargaining power of suppliers

………………………………

About Us:

MarketSizeForecasters.com, a Skyline Market Research LLP brand, is an online aggregator of market research reports. MarketSizeForecasters.com offers a comprehensive collection of full length reports on global and regional markets in 100+ industry verticals. We have partnered with some of the leading business and market research publishing houses and regularly update our online library to offer wide range of reports to our customers.

Contact Us:

Market size forecasters

The Green Suite #4594,

Dover, DE 19901

United States

Phone: 1-201-355-0868

US Toll Free: 1-866-764-2150

Email: [email protected]

Website: http://marketsizeforecasters.com/

News: https://marketsizeforecasters.com/news  

Connect with us: LinkedIn | Twitter

For More Details On of this Report: https://marketsizeforecasters.com/global-semiconductor-packaging-materials-market-technavio/?utm_source=ABD-dc

Related Report:

Global Electrostatic Discharge (ESD) Foam Packaging Market Professional Survey Report 2017

This report studies Electrostatic Discharge (ESD) Foam Packaging in Global market, especially in North America, China, Europe, Southeast Asia, Japan and India, with production, revenue, consumption, import and export in these regions, from 2012 to 2016, and forecast to 2022.

https://marketsizeforecasters.com/global-electrostatic-discharge-esd-foam-packaging-market/?utm_source=ABD-dc